Water Wash Technologies
"Manufacturing and Sales of Products for High Tech Devices"
Temporary bonding adhesives are used in manufacturing to hold two substrates together during a specific process and later must be separated and cleaned. Thin substrates are much too fragile to be handled by normal tooling and as such are temporarily bonded onto rigid supports, commonly referred to a carriers.
The adhesives are commonly formulated to exhibit properties that withstand the rigors of the manufacturing process such as thermal and chemical exposure, while allowing simple separation and cleaning when finished.
Products
Benefit
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High Thermal Resistance
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Low Outgas
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Tunable Adhesion
Applications
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Wafer Level and Chip Level Packaging (3DIC, MEMs, Various Bumping Technologies)
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Display
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LED
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OLED
Temporary Adhesives for Thinned Microelectronics, Semiconductor and FPD
Water Wash Technologies offers Temporary Adhesives for Microelectronic Manufacturing Processes. Each product is carefully formulated to provide low outgas, high thermal resistance, tunable adhesion and can be removed easily using the appropriate DaeClean product.
DaeCoat 310
Specialty Adhesive for Low Temperature OLED Processing.
Allows DaeCoat 210 or similar Polyimide Substrates to Peel From Glass.
Two-Part System Provides Control Over Adhesion and Peel Force of Polyimide.
DaeCoat 350
Temporary or Permanent Bonding Agent for Display and Semiconductor Manufacturing Processes.
Bonds Substrates at Low Temperatures; Exhibits High Thermal and Chemical Resistance.
Clean Compatibility = DaeClean 300
DaeCoat 615
Protective Coating and Temporary Bonding Agent for Semiconductor Manufacturing Processes.
Exhibits High Acid Resistance and Stable at Process Temperatures up to 200C.
Cleans Compatibility = DaeClean 210, DaeClean 250