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Products

 

Benefits

  • High Thermal Resistance

  • Hard, Rigid Coating

  • High Tensile Strength

  • Peelable from Glass when used with DaeCoat 310 Adhesive

 

Industries

  • Wafer Level and Chip Level Packaging (3DIC, MEMs, Various Bumping Technologies)

  • Display

  • LED

  • OLED

 

Anchor 4

DaeClean 210

Ready to Use Aqueous Alkali Detergent, Designed for Negative Tone Photoresist Removal in Semiconductor Manufacturing.

 

Cleans Compatibility = DaeCoat 515, DaeCoat 550, DaeCoat 615

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Castable Flexible Substrate

 

Water Wash Technologies offers polyimide for flexible substrate applications.  The DaeCoat 210 is carefully formulated to provide low outgas, great thermal resistance, high adhesion and even higher tensile than conventional polyimides. 

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