The process of creating a mechanically effective wafer bonder is no easy task. There are many design parameters that must be taken into consideration to ensure the precise execution of multi-step bonding. The Design Engineers at Water Wash Technology have examined all the requirements in a bonding process and channeled them into an impressive tool that handles any bonding application. This unique and novel approach for bonding at Water Wash Technology provides higher throughput and lower development & manufacturing costs altogether. Our wafer bonder is a multi-functional tool that is thermally operated by induction heating, which entails a more rapid and clean heating method versus traditional conduction or radiation. To ensure a secure bond with various types of adhesives, user-specified pressure is evenly applied to the wafer stack. Vacuum is also applied within the bonding chamber to drive particles out of the system and create a vacuum tight bond line. Using this innovative bonding technique, coupled with adhesives from the Daebond product line, your company’s bonding process will be streamlined!