Water Wash Technologies
"Manufacturing and Sales of Products for High Tech Devices"
The removal of photoresists and other polymers is well documented by methods of dissolving, substrate lifting, or undercut (etch) and release. Sometimes engineered solutions must be used, however, they require monitoring to confirm substrate and metal safety. Water Wash Technologies offers alternative approaches. We have successfully removed highly cured urethanes, silicones, polysulfides, acrylics, polyimides, isoprenes, and related systems. In some cases, demonstrated novel processes that dissolve and remove these in water.
Coatings are used for a wide range of applications in manufacturing. Water Wash Technologies has developed specialty coatings for both temporary and permanent applications. These materials are applied by spin, spray, dip, or roll-coat means. We offer a wide range of materials to meet unique property and performance objectives not currently seen in any process.
Temporary bonding adhesives are used in manufacturing to hold two substrates together during a specific process and later must be separated and cleaned. Example processes include the fabrication of electronic circuits onto thin substrates in semiconductor or display markets. Thin substrates are much too fragile to be handled by normal tooling and as such are temporarily bonded onto rigid supports, commonly referred to as carriers.
3DIC
In semiconductor manufacturing, there continues to be a demand for miniaturization, higher complexity, and merging heterogenous die (i.e. memory + logic, etc.). As a result, new solutions are being sought to produce smaller packages at lower cost. Three-dimensional integrated circuits (3DIC) requires stacks of thin heterogenous die connected by through silicon vias (TSVs). Water Wash Technologies offers simple, high throughput, and low cost practices to enable 3DIC manufacturing.
As thinning and miniaturization influences display operations, the handling of thin and flexible glass is presented with many challenges. Many facilities are now exploring organic substrates as polymers to replace glass. A fundamental part of this evolution is the application of low temperature polysilicon (LTPS), indium tin oxide (ITO) or other plasma deposited material used to build the transistor. A typical process flow involves the application and cure of a thin polymer to a glass carrier, device fabrication, and de-bonding by a peeling process.